The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2009

Filed:

Sep. 30, 2003
Applicants:

Seung H. Kang, Macungie, PA (US);

Roland P. Krebs, Allentown, PA (US);

Kurt George Steiner, Fogelsville, PA (US);

Michael C. Ayukawa, Zionsville, PA (US);

Sailesh Mansinh Merchant, Breinigsville, PA (US);

Inventors:

Seung H. Kang, Macungie, PA (US);

Roland P. Krebs, Allentown, PA (US);

Kurt George Steiner, Fogelsville, PA (US);

Michael C. Ayukawa, Zionsville, PA (US);

Sailesh Mansinh Merchant, Breinigsville, PA (US);

Assignee:

Agere Systems Inc., Allentown, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01);
U.S. Cl.
CPC ...
Abstract

An integrated circuit device structure and a process for fabricating the structure wherein the power bus interconnect structure is formed in the aluminum pad or contact layer. An interconnect structure for interconnecting underlying levels of interconnect can also be formed in the aluminum pad layer.


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