The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2009
Filed:
Apr. 22, 2007
Applicants:
Heng Keong Yip, Subang Jaya, MY;
Thoon Khin Chang, Kuala Lumpur, MY;
Chee Seng Foong, Sg. Buloh, MY;
Inventors:
Heng Keong Yip, Subang Jaya, MY;
Thoon Khin Chang, Kuala Lumpur, MY;
Chee Seng Foong, Sg. Buloh, MY;
Assignee:
Freescale Semiconductor Inc., Austin, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of making a solder pad includes providing a substrate having a metal layer formed on it, and applying a photo resist to the metal layer. The photo resist is patterned. A first etching operation is performed on the metal layer to form voids in the metal layer. A second etching operation is performed on the metal layer to form the solder pad. A solder mask is formed on the substrate and a portion of the solder pad.