The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2009
Filed:
Oct. 13, 2006
Koujiro Kameyama, Gunma, JP;
Kiyoshi Mita, Gunma, JP;
Koujiro Kameyama, Gunma, JP;
Kiyoshi Mita, Gunma, JP;
Sanyo Electric Co., Ltd., Osaka, JP;
Kanto Sanyo Semiconductors Co., Ltd., Gunma, JP;
Abstract
To provide a semiconductor device, which is thin, compact, and excellent in mechanical strength and humidity resistance. Semiconductor deviceA has a configuration such that in semiconductor deviceA, wherein an optical semiconductor element, having a light receiving part or a light emitting part, is sealed in a sealing resin, a cover layer, covering the top surface of optical semiconductor element, is exposed from the top surface of sealing resin. Thus in comparison to a related-art example with which the entirety is sealed by a transparent resin, sealing resincan be formed thinly and the thickness of the entire device can be made thin. Furthermore, semiconductor deviceis arranged using a sealing resin having a filler mixed in. A semiconductor device that is excellent in mechanical strength and humidity resistance can thus be arranged.