The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2009
Filed:
Jul. 30, 2007
Shinji Murata, Fukushima, JP;
Shinji Murata, Fukushima, JP;
ALPS Electric Co., Ltd., Tokyo, JP;
Abstract
A method according to the present invention for producing a semiconductor-chip-mounting circuitincludes mainly three steps. In a first step, contactseach in the form of a conical helix are formed by solder-plating the surface of connecting terminalson a mounting circuitIn a second step, a continuity test is performed by pressing bumpsagainst the contactsIn a final third step, the contactspressed are melted to connect the connecting terminalsto the bumpsThat is, the semiconductor chipis connected to the mounting circuitwhile maintaining a state in which they pass the continuity test, thereby significantly reducing the occurrence of defective continuity in the semiconductor-chip-mounting circuit