The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2009
Filed:
Mar. 16, 2007
Kazuyuki Yamashita, Toyama, JP;
Mieko Omotani, Toyama, JP;
Takashi Onaga, Futagami-machi, JP;
Kiyokazu Himi, Futagami-machi, JP;
Kazuyuki Yamashita, Toyama, JP;
Mieko Omotani, Toyama, JP;
Takashi Onaga, Futagami-machi, JP;
Kiyokazu Himi, Futagami-machi, JP;
Richell Corporation, , JP;
Toyama Prefecture, , JP;
Abstract
A bonded structure formed by bonding a first structure and a second structure at opposed bonding surfaces to form a microstructure or the like. At least one of the first structure and the second structure is formed of a resin composition including a polypropylene resin and a hydrogenated derivative of a block copolymer of the following general formula X-Y (X is a polymer block immiscible with the polypropylene resin, and Y is a conjugated diene elastomer polymer block). The bonding surfaces are bonded by heating an alkoxysilane or alkylsilane compound or a mixture prepared by adding a hydrogenated derivative of a block copolymer of the general formula X-Y to an alkoxysilane or alkylsilane compound applied to the bonding surface.