The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2009
Filed:
Mar. 31, 2004
Hidetsugu Motobe, Koriyama, JP;
Akinori Hibino, Koriyama, JP;
Katsuhiko Ito, Fukushima, JP;
Matsushita Electric Works, Ltd., Osaka, JP;
Abstract
An epoxy resin composition for printed wiring boards which comprises an epoxy resin, a phenolic novolak, a curing accelerator, and a silica filler, characterized in that the silica filler has a shape having at least two planes and has an average particle diameter of 0.3 to 10 μm and a specific surface area of 8 to 30 m/g. The epoxy resin composition has a higher apparent viscosity than the resins and can hence be inhibited from sagging in a drying oven. This composition retains the intact property of infiltration into reinforcements because the viscosity of the resins themselves has not increased locally. The composition hence produces the effect of improving the appearance of a prepreg.