The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2009
Filed:
Nov. 08, 2005
Yuichiro Okuyama, Tokyo, JP;
Hideya Matsubara, Tokyo, JP;
Shinya Nakai, Tokyo, JP;
Masashi Iwata, Tokyo, JP;
Yuichiro Okuyama, Tokyo, JP;
Hideya Matsubara, Tokyo, JP;
Shinya Nakai, Tokyo, JP;
Masashi Iwata, Tokyo, JP;
TDK Corporation, Tokyo, JP;
Abstract
A high frequency module comprises a layered substrate. Inside the layered substrate, a reception diplexer for processing reception signals and a transmission diplexer for processing transmission signals are provided. The reception diplexer and the transmission diplexer are located in two different regions inside the layered substrate. A conductor portion that is connected to the ground and that electromagnetically separates the reception diplexer and the transmission diplexer from each other is provided between the two regions inside the layered substrate. The conductor portion is formed by using a plurality of through holes.