The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2009

Filed:

Sep. 16, 2003
Applicants:

Edwin Maria Wolterink, Eindhoven, NL;

Gerardus Maria Dohmen, Eindhoven, NL;

Aloysius Franciscus Maria Sander, Eindhoven, NL;

Arjen Gerben Van Der Sijde, Eindhoven, NL;

Leendert DE Bruin, Eindhoven, NL;

Erik Harold Groot, Eindhoven, NL;

Anton Petrus Maria Van Arendonk, Eindhoven, NL;

Inventors:

Edwin Maria Wolterink, Eindhoven, NL;

Gerardus Maria Dohmen, Eindhoven, NL;

Aloysius Franciscus Maria Sander, Eindhoven, NL;

Arjen Gerben Van der Sijde, Eindhoven, NL;

Leendert De Bruin, Eindhoven, NL;

Erik Harold Groot, Eindhoven, NL;

Anton Petrus Maria Van Arendonk, Eindhoven, NL;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/225 (2006.01); H01L 29/78 (2006.01); H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention relates to a camera device and a method for manufacturing such a device. The camera device comprises an image capturing element, a lens element for imaging an object at the image capturing element and a spacer means for maintaining a predetermined distance along the main optical axis though the lens and the image capturing element, and lens substrate for carrying the lens wherein the spacer means comprises an adhesive layer. This enables a mass manufacturing process wherein parts of the individual camera elements can be manufactured in manifold on different substrates, after which the different substrates are stacked, aligned and joined via adhesive layers. In the manufacturing process the different distances between the plates and the wafers are adjusted and maintained via the spacer means comprising the adhesive layers. From the stack individual camera devices are sawn out.


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