The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2009
Filed:
Jun. 04, 2003
Jin Hyung Ryu, Bucheon-si, KR;
Sam Je Cho, Anyang-si, KR;
Jin Hyung Ryu, Bucheon-si, KR;
Sam Je Cho, Anyang-si, KR;
LG Electronics Inc., Seoul, KR;
Abstract
Disclosed is a semiconductor package and method for package a semiconductor that has high reliability. A semiconductor package according to the present invention comprises a first substrate on which a circuit pattern and an electrode pad are formed; a second substrate which is adhered to the first substrate and on which a hole is formed; and a solder ball adhered to the electrode pad through the hole formed on the second substrate. Then, the second substrate is used as a solder resist. Accordingly, since the first substrate and the second substrate are formed of same material, the BGA package can be prevented from being cracked and being nonuniform when fired.