The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2009
Filed:
Jul. 06, 2007
Felix C. LI, Sunnyvale, CA (US);
Felix C. Li, Sunnyvale, CA (US);
National Semiconductor Corporation, Santa Clara, CA (US);
Abstract
A semiconductor device is provided, which comprises: a die including an active surface; a multiplicity of bond pads formed on the active surface of the die, wherein a first one of the bond pads is larger than a second one of the bond pads; and a multiplicity of solder bumps, each formed over a corresponding bond pad, wherein the multiplicity of solder bumps include a first solder bump formed over the first bond pad and a second solder bump formed over the second bond pad, the first solder bump having a footprint that is substantially larger than the second solder bump and a maximum diameter that is substantially larger than the second solder bump.