The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7563640 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 21, 2009

Filed:

Sep. 11, 2007
Applicants:

Shinji Wakisaka, Hanno, JP;

Hiroyasu Jobetto, Hachioji, JP;

Takeshi Wakabayashi, Sayama, JP;

Ichiro Mihara, Tachikawa, JP;

Inventors:

Shinji Wakisaka, Hanno, JP;

Hiroyasu Jobetto, Hachioji, JP;

Takeshi Wakabayashi, Sayama, JP;

Ichiro Mihara, Tachikawa, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

A first semiconductor element is mounted on a base plate, and is in a sealed state by the periphery thereof being covered by an insulation member, and the upper surface thereof being covered by an upper insulation film. An upper wiring layer formed on the upper insulation film, and the lower wiring layer formed below the base plate via lower insulation films are connected by conductors. A second semiconductor element is mounted exposed, being connected to the lower wiring layer.


Find Patent Forward Citations

Wakisaka, Shinji. (2009). Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof (U.S. Patent No. 7563640). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7563640

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