The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2009
Filed:
Jun. 06, 2005
Scott D. Brandenburg, Kokomo, IN (US);
Bruce A. Myers, Kokomo, IN (US);
Scott D. Brandenburg, Kokomo, IN (US);
Bruce A. Myers, Kokomo, IN (US);
Delphi Technologies, Inc., Troy, MI (US);
Abstract
A circuit assembly containing a surface mount (SM) IC package wire bonded to a substrate and configured to conduct heat from the package into a heat sink through a heat-conducting member instead of the substrate. The package contains an IC device with input/output pads on a surface thereof that are connected with leads to conductors on the substrate. The heat sink is located adjacent the package so as not to be separated from the package by the substrate. The heat-conducting member is positioned adjacent the surface of the device opposite its input/output pads, and is bonded to the device and heat sink to provide a heat path between the package and heat sink that does not pass through the substrate.