The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2009
Filed:
Jun. 07, 2006
Eric S. Mindock, Playa del Rey, CA (US);
John R. Scott, Torrance, CA (US);
Eric S. Mindock, Playa del Rey, CA (US);
John R. Scott, Torrance, CA (US);
The Boeing Company, Chicago, IL (US);
Abstract
An apparatus and method for cooling electronics is disclosed. An encapsulated inert non-conductive fluid is used to transfer heat directly from an electrical circuit including a die on a substrate to an external heatsink. The top of a flip chip die (e.g. a ceramic column grid array flip chip) may be enclosed with a metallic cover. The metallic cover is sealed to an outer frame, which in turn is sealed to metallization on the top of the flip chip through a flexure, minimizing mechanical load imparted to the flip chip. This forms a hermetic cavity enclosing the die. This hermetic cavity is partially filled with an inert non conductive fluid, which vaporizes when heated. Condensation occurs on the inner surface of the metal cover where the heat may be conducted into the outer frame for removal (e.g. rejection from the spacecraft).