The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2009
Filed:
Feb. 25, 2005
Applicants:
Ryuji Nishikawa, Gifu, JP;
Tetsuji Omura, Ogaki, JP;
Masaya Nakai, Gifu, JP;
Inventors:
Assignee:
Sanyo Electric Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 19/50 (2006.01);
U.S. Cl.
CPC ...
Abstract
A metal solder layer is formed on a sealing substrate through patterning. A pixel substrate is overlapped to the sealing substrate and the solder layer is irradiated with laser so that the sealing substrate and the pixel substrate are connected. Because the joining is achieved by the metal solder layer, intrusion of moisture into the inside space can be reduced. In addition, the solder layer can be very precisely formed through patterning.