The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2009
Filed:
Jul. 25, 2006
Applicants:
Chuen-der Lien, Los Altos Hills, CA (US);
Shih-ked Lee, Fremont, CA (US);
Inventors:
Chuen-Der Lien, Los Altos Hills, CA (US);
Shih-Ked Lee, Fremont, CA (US);
Assignee:
Integrated Device Technology, Inc., San Jose, CA (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
Abstract
A die seal structure for sealing integrated circuit devices formed on a semiconductor substrate. The die seal structure includes a die seal and a junction diode. The die seal only connects to the semiconductor substrate through the junction diode, thereby reducing noise coupling through the die seal. In another aspect of the present invention the die seal structure includes a die seal and a bipolar structure. In this embodiment the die seal only connects to the semiconductor substrate through the bipolar structure.