The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2009
Filed:
Jan. 17, 2006
Applicants:
Hidehiro Sasaki, Kanuma, JP;
Akinobu Hira, Kanuma, JP;
Keiichi Hashimoto, Kanuma, JP;
Hisao Tokoro, Kanuma, JP;
Inventors:
Hidehiro Sasaki, Kanuma, JP;
Akinobu Hira, Kanuma, JP;
Keiichi Hashimoto, Kanuma, JP;
Hisao Tokoro, Kanuma, JP;
Assignee:
JSP Corporation, , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 9/16 (2006.01);
U.S. Cl.
CPC ...
Abstract
A process of producing a foamed molding, wherein expanded, substantially non-crosslinked polypropylene-based resin beads are heated in a mold to fuse-bond the beads together into a unitary body. Each of the expanded beads has been surface-modified with an organic peroxide.
Sasaki, Hidehiro. (2009). Process of producing foamed molding from expanded polypropylene resin beads and process of producing expanded polypropylene resin beads (U.S. Patent No. 7560498). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7560498
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile