The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2009
Filed:
Dec. 27, 2007
Louis L. C. Hsu, Fishkill, NY (US);
Rajiv V. Joshi, Yorktown Heights, NY (US);
Jack Allan Mandelman, Flat Rock, NC (US);
Louis L. C. Hsu, Fishkill, NY (US);
Rajiv V. Joshi, Yorktown Heights, NY (US);
Jack Allan Mandelman, Flat Rock, NC (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method of fabricating a semiconductor device includes etching a substrate formed on a backside of a semiconductor wafer to form a recess in the substrate, and forming a sputter film in the recess, the sputter film including a first material having a coefficient of thermal expansion (CTE) which is at least substantially equal to a CTE of the substrate, and a second material having a thermal conductivity which is greater than a thermal conductivity of the substrate.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile