The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2009
Filed:
Mar. 28, 2006
Takaaki Banno, Nagoya, JP;
Yuji Shinkai, Handa, JP;
Takaaki Banno, Nagoya, JP;
Yuji Shinkai, Handa, JP;
Brother Kogyo Kabushiki Kaisha, Nagoya-shi, Aichi-ken, JP;
Abstract
A method for manufacturing bonded substrates includes: forming the first terminals on the first substrate, the first terminals each having a metal core projecting from a surface of the first substrate, each metal core coated with a solder layer lower in a melting point than the metal core; forming the conductive second terminals on the second substrate; and electrically bonding the first terminals to the second terminals by heating the first and second substrates while applying pressure to the first substrate and the second substrate. In the forming of the first terminals, a ratio of a height of the metal core from the surface of the first substrate in a thickness direction of the first substrate to a thickness of the solder layer in the thickness direction of the first substrate is in a range of from 1:1 to 2:1.