The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2009
Filed:
Nov. 06, 2006
Applicant:
Yoichi Noda, Fujimi, JP;
Inventor:
Yoichi Noda, Fujimi, JP;
Assignee:
Seiko Epson Corporation, , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/20 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method for manufacturing an active matrix substrate, comprises forming a first conductive layer across a first wiring line forming area and a second wiring line forming area on a substrate including a first wiring line and a second wiring line having a width narrower than a width of the first wiring line, and forming a second conductive layer on the first conductive layer formed in the first wiring line forming area in a layered state, and on the first conductive layer formed in the second wiring line forming area in a non-layered state.