The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2009

Filed:

Jan. 26, 2007
Applicants:

Hideki Hirakawa, Hirosaki, JP;

Akira Souma, Hirakawa, JP;

Takayuki Hayashizaki, Hirakawa, JP;

Shinji Kuniyoshi, Tokyo, JP;

Inventors:

Hideki Hirakawa, Hirosaki, JP;

Akira Souma, Hirakawa, JP;

Takayuki Hayashizaki, Hirakawa, JP;

Shinji Kuniyoshi, Tokyo, JP;

Assignee:

Kabushiki Kaisha Nihon Micronics, Musashino-shi, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 1/067 (2006.01); H01R 12/00 (2006.01); H01R 4/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A probe for electrical test comprises a probe body having a base end attached to a support base plate through a solder and a front end continuous with said base end and a surface layer showing a conductivity higher than that of the probe body and a solder wettability higher than that of the probe body and extending on the surface of the probe body from the base end to the front end. In the vicinity of the base end of the surface layer, a shield region having a smaller solder wettability than that of the surface layer is formed across the surface layer.


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Hirakawa, Hideki. (2009). Probe for electrical test and probe assembly (U.S. Patent No. 7557593). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7557593

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