The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2009
Filed:
Oct. 30, 2006
Junichi Nakao, Hyogo-ken, JP;
Junichi Nakao, Hyogo-ken, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
A semiconductor device comprises a first electrode-lead having a first Au film, a first Ni film, a Cu film, a second Au film and a second Ni film stacked in order, a second electrode-lead having a first Au film, a first Ni film, a Cu film, a second Au film and a second Ni film stacked in order and a semiconductor chip having a first electrode formed on a first surface of the semiconductor chip and a second electrode formed on a second surface of the semiconductor chip, the first electrode being formed on an opposite side of the second electrode. The semiconductor chip mounted on the first electrode-lead, the second electrode facing the first surface of the first electrode-lead. A first connection conductor is connected the first electrode of the semiconductor chip to the first surface of the second electrode-lead. The first electrode-lead, the second electrode-lead and the semiconductor chip are housed in a package. The second surface of the first electrode-lead and the second surface of the second electrode-lead are exposed at a surface of the package.