The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2009

Filed:

Aug. 24, 2006
Applicants:

Hiroshi Yamamoto, Konan, JP;

Toshitake Seki, Komaki, JP;

Shinji Yuri, Kasugai, JP;

Masaki Muramatsu, Komaki, JP;

Motohiko Sato, Konan, JP;

Akifumi Tosa, Komaki, JP;

Inventors:

Hiroshi Yamamoto, Konan, JP;

Toshitake Seki, Komaki, JP;

Shinji Yuri, Kasugai, JP;

Masaki Muramatsu, Komaki, JP;

Motohiko Sato, Konan, JP;

Akifumi Tosa, Komaki, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/053 (2006.01);
U.S. Cl.
CPC ...
Abstract

A wiring board includes a substrate core and a ceramic chip to be embedded therein. The substrate core has a housing opening portion opening at a core main surface. The ceramic chip is accommodated in the housing opening portion so that the core main surface and a chip first main surface face the same way. The ceramic chip includes a plurality of second terminal electrodes comprised of a metallized layer and formed on the chip second main surface so as to protrude therefrom. A projecting portion, disposed on the second main surface side so as to surround a plurality of the second terminal electrodes, is formed on the chip second main surface so as to protrude therefrom.


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