The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7557039 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 07, 2009

Filed:

Jun. 29, 2006
Applicants:

Sang-oh Lee, Kyoungki-do, KR;

Sung-kwon Lee, Kyoungki-do, KR;

Inventors:

Sang-Oh Lee, Kyoungki-do, KR;

Sung-Kwon Lee, Kyoungki-do, KR;

Assignee:

Hynix Semiconductor Inc., Kyoungki-Do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for forming a contact hole of a semiconductor device includes: forming a lower pattern over a substrate; forming a spin-on-glass (SOG) layer over the lower pattern; performing a first curing process on the SOG layer; forming an opening exposing a portion of the SOG layer; performing a second curing process on the SOG layer corresponding to a lower portion of the opening; and forming a contact hole exposing the lower pattern.


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Lee, Sang-Oh. (2009). Method for fabricating contact hole of semiconductor device (U.S. Patent No. 7557039). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7557039

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