The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2009
Filed:
Jan. 30, 2007
Kiyoaki Kadoi, Chiba, JP;
Kiyoaki Kadoi, Chiba, JP;
Seiko Instruments Inc., , JP;
Abstract
A dicing blade () which rotates at high speed is surrounded by a case (). A semiconductor wafer () is cut by a dicing device in which the case is filled with a cooling water (). The case () is provided with a cooling water nozzle () for continuously supplying the cooling water and a gap () for discharging the cooling water out of the case. By adjusting a supply rate and a discharge rate of the cooling water, a proper water pressure can be applied to an inside of the case, thereby making it possible to cool the dicing blade and the cutting point with efficiency. As a result, it is possible to suppress chipping and cracking of the semiconductor device due to lack of cooling.