The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2009
Filed:
Oct. 14, 2005
Applicants:
Norio Fukasawa, Kawasaki, JP;
Hirohisa Matsuki, Kawasaki, JP;
Kenichi Nagashige, Kawasaki, JP;
Yuzo Hamanaka, Kawasaki, JP;
Muneharu Morioka, Kawasaki, JP;
Inventors:
Norio Fukasawa, Kawasaki, JP;
Hirohisa Matsuki, Kawasaki, JP;
Kenichi Nagashige, Kawasaki, JP;
Yuzo Hamanaka, Kawasaki, JP;
Muneharu Morioka, Kawasaki, JP;
Assignee:
Fujitsu Microelectronics Limited, Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device has a resin package layer on a principal surface of a semiconductor chip, on which a number of bump electrodes are formed, wherein the semiconductor device has a chamfer surface or a stepped surface on a top edge part such that the external shock or stress applied to such an edge part is dissipated by the chamfer surface of the stepped surface.