The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2009
Filed:
Jul. 13, 2004
Masahiro Yamakawa, Osaka, JP;
Kohei Shimoda, Osaka, JP;
Masahiro Yamakawa, Osaka, JP;
Kohei Shimoda, Osaka, JP;
Sumitomo Electric Industries, Ltd., Osaka, JP;
Abstract
Provided is a conductive paste which can have high conductivity even if the sintering temperature is 500° C. or less, and which does not cause an interference pattern or crack on a substrate even if a thick film thereof is formed on the substrate. The conductive paste comprises main components including a metal powder, a glass frit, and an organic vehicle. The metal powder is composed of spherical particles (A) having an average primary-particle diameter of 0.1 to 1 μm and spherical particles (B) having an average primary-particle diameter of 50 nm or less, and the content of spherical particles (A) ranges from 50 to 99 wt % and the content of spherical particles (B) ranges from 1 to 50 wt %. The content of the glass frit ranges from 0.1 wt % to 15 wt % to the total amount of the glass frit and the metal powder. Preferably, the glass frit does not contain lead and has a working point of 500° C. or less, and the average particle diameter thereof is 2 μm or less. The present invention can widely be applied to print on a substrate and sinter so as to form an electric circuit on the substrate.