The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2009

Filed:

Mar. 25, 2004
Applicants:

Jun Fujita, Nagoya, JP;

Naoshi Masukawa, Aichi, JP;

Inventors:

Jun Fujita, Nagoya, JP;

Naoshi Masukawa, Aichi, JP;

Assignee:

NGK Insulators, Ltd., Nagoya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 65/00 (2006.01); B32B 37/00 (2006.01); C03B 29/00 (2006.01); C04B 33/34 (2006.01); C04B 37/00 (2006.01); B29C 65/48 (2006.01); B32B 3/12 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of bonding at least a first ceramics structure () to a second ceramics structure (), which includes the steps of applying a pressure to the first ceramics structure () and the second ceramics structure () in such a direction that these structures move close to each other with a bonding material layer () interposed between the first ceramics structure () and the second ceramics structure () (FIG. A), removing a bonding material () extruded from the bonding material layer () to an end face of a stacked body including the first ceramics structure () and the second ceramics structure () by the application of the pressure thereto (FIG. B), drying a bonding material () near the end face of the stacked body () after the extruded bonding material () is removed (FIG. C), and drying the entire part of the stacked body ().


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