The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2009
Filed:
Nov. 30, 2004
Jeffrey J. Kilwin, St. Peters, MO (US);
Ronald J. Newcomer, St. Louis, MO (US);
Philip L. Freeman, Maryland Heights, MO (US);
Jeffrey J. Kilwin, St. Peters, MO (US);
Ronald J. Newcomer, St. Louis, MO (US);
Philip L. Freeman, Maryland Heights, MO (US);
The Boeing Company, Chicago, IL (US);
Abstract
A self-locating feature for a pi-joint assembly is provided. The pi-joint assembly includes a substructure, a member coupled to the substructure. The substructure includes one or more land extending above one of a front side and a back side of the substructure. The land includes an outer surface, a depth location control surface and an edge location control surface. The member includes a base, a pair of axially elongated leg extending from the base to define a channel therebetween, and one or more notch located in one of the pair of axially elongated leg. The notch includes a depth contact location control surface and an edge contact location control surface, wherein the depth location control surface of the land of the substructure is correspondingly coupled to the depth contact location control surface of the notch located in one of the axially elongated leg, and the edge location control surface of the land of the substructure is correspondingly coupled to the edge contact location control surface of the notch located in one of the axially elongated leg. A method of assembling a pi-joint assembly of the present invention is also provided.