The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2009

Filed:

Apr. 28, 2008
Applicants:

Mamoru Kudo, Kanagawa, JP;

Kenichi Shigenami, Kanagawa, JP;

Shunichi Sukegawa, Ibaraki, JP;

Inventors:

Mamoru Kudo, Kanagawa, JP;

Kenichi Shigenami, Kanagawa, JP;

Shunichi Sukegawa, Ibaraki, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/50 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device includes a first semiconductor package, a second semiconductor package. The first semiconductor package includes a first semiconductor package base having a first cavity formed therein, a first mount component mounted in the first cavity, and a first magnet disposed on the first semiconductor package base. The second semiconductor package includes a second semiconductor package base having a second cavity formed therein, a second mount component mounted in the second cavity, and a second magnet disposed on the second semiconductor package base so as to adsorb the first magnet. The first semiconductor package and the second semiconductor package are stacked by an adsorption of magnetic force between the first magnet and the second magnet.


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