The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2009

Filed:

Oct. 05, 2004
Applicants:

Hiroshi Kawato, Chiba, JP;

Yoshihiko Horio, Chiba, JP;

Yasuhiro Ishikawa, Chiba, JP;

Inventors:

Hiroshi Kawato, Chiba, JP;

Yoshihiko Horio, Chiba, JP;

Yasuhiro Ishikawa, Chiba, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 69/00 (2006.01); C08K 5/50 (2006.01);
U.S. Cl.
CPC ...
Abstract

A polycarbonate resin composition comprising polycarbonate resin (A) and, blended therewith per 100 parts by mass thereof, 0.001 to 0.1 part by mass of arylphosphine (B) and 0.01 to 1.0 part by mass of alicyclic epoxy compound (C); or a polycarbonate resin composition comprising polycarbonate resin (A) and, blended therewith per 100 parts by mass thereof, 0.001 to 0.1 part by mass of arylphosphine (B), 0.01 to 1.0 part by mass of alicyclic epoxy compound (C) and 0.01 to 1.0 part by mass of acrylic resin (D). The polycarbonate resin composition exhibits excellent optical properties, excelling in resistance to high temperature high humidity, resistance to heat aging (especially high temperature aging), heat resistance and impact resistance, and is suitable for production of optical parts, such as a lens of optical semiconductor device mounted on vehicles which can be used even in especially severe environment. There is further provided an optical part molded from the polycarbonate resin composition.


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