The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2009
Filed:
Oct. 31, 2005
Applicant:
Toshiki Hara, Suwa, JP;
Inventor:
Toshiki Hara, Suwa, JP;
Assignee:
Seiko Epson Corporation, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/84 (2006.01); H01L 21/31 (2006.01); H01L 21/3205 (2006.01); H01L 21/336 (2006.01); H01L 29/786 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor substrate includes a semiconductor base substrate that has an oxide film selectively formed on a part thereof, the oxide film having a non-uniform thickness; and a semiconductor layer that is formed on the oxide film by epitaxial growth so as to have a non-uniform thickness.
Hara, Toshiki. (2009). Method of manufacturing semiconductor substrates and semiconductor devices (U.S. Patent No. 7553713). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7553713
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile