The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2009
Filed:
Aug. 21, 2008
Joon-mo Seo, Gyeonggi-do, KR;
Byoung-un Kang, Seoul, KR;
Jae-hoon Kim, Seoul, KR;
Soon-young Hyun, Gyeonggi-do, KR;
Ji-eun Kim, Gyeonggi-do, KR;
Jun-woo Lee, Gyeonggi-do, KR;
Ju-hyuk Kim, Seoul, KR;
Joon-Mo Seo, Gyeonggi-do, KR;
Byoung-Un Kang, Seoul, KR;
Jae-Hoon Kim, Seoul, KR;
Soon-Young Hyun, Gyeonggi-do, KR;
Ji-Eun Kim, Gyeonggi-do, KR;
Jun-Woo Lee, Gyeonggi-do, KR;
Ju-Hyuk Kim, Seoul, KR;
LS Mitron Ltd., Anyang, KR;
Abstract
The present invention relates to a semiconductor packaging method. The method comprises (S) applying a die adhesive to an upper surface of a member through screen-printing; (S) B-stage curing the member having the die adhesive; (S) attaching a die on the B-stage cured die adhesive; (S) wire-bonding the die to the member; and (S) encapsulating the outside of the resultant, after the B-stage curing process of the step S, a degree of cure of the die adhesive shows a decrease in heat capacity by 80 to 100%, and the step Sis performed such that the die adhesive maintains an adhesive strength of 10 kgf/cmor more at normal temperature after the die attaching.