The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2009
Filed:
May. 31, 2006
Tomihisa Kato, Aichi-ken, JP;
Tomihisa Kato, Aichi-ken, JP;
Asahi Intecc Co., Ltd., Aichi-ken, JP;
Abstract
In a heat mold devicefor a guide wire, the metallic mold bodyis made from the material, the thermal expansional coefficient of which is the same of a metallic coiled wireto stabilize a shape-forming configuration. A plurality of the mold bodiesare arranged in a mold frameA to make the reverse sideof one mold bodytightly contact with the obverse sideof other mold bodyamong the neighboring mold bodies. A jig armA sandwiches an array of metallic mold bodiesand the side plateto serve as a securement member. Upon manufacturing the guide wirewell-suited to the medical field, the heat mold devicerenders it possible to make a high quality guide wire with a high productivity.