The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2009
Filed:
Jun. 07, 2005
Hyun Sam Cho, Salt Lake City, UT (US);
Hyun Sam Cho, Salt Lake City, UT (US);
ADICO, Asia Polydiamond Company, Ltd., Kyungki-do, KR;
Abstract
A new industrial thermally stable polycrystalline diamond (TSP) is disclosed and described as a replacement of natural as well as synthetic diamond grit in concrete cutting, grinding, polishing, and surface-set grinding or core bit drilling applications. Conventional diamond is too strong and brittle for self-sharpening and polishing and has a lower thermal stability inferior to the industrial standard for high temperature tool segment bonding. TSP grits can be tailor-made having unique properties as well as an engineered shape of grits over naturally or synthetically produced diamond grits. The TSP grits have a high thermal stability of up to 1200° C. and are self-sharpening. Further, economical production of coarse TSP grit size up to 1-2 mm from 50/60 mesh size in almost any preferred shape such as blocky, round, hexagonal, thin elongated, spherical, needle like, and any desirable tailor-made shaped etc can be realized. The use of a partition member during production of the TSP grits allows for the effective manufacturing of desired shaped grits as compared to laborious and ineffective low yield crushing of TSP material. Advantageously, the process time can also be exceptionally shorter than conventional HPHT processes.