The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2009

Filed:

May. 11, 2006
Applicants:

Shan Guan, Dublin, OH (US);

Michael F. Baumer, Dayton, OH (US);

Richard W. Sexton, Bainbridge, OH (US);

James E. Harrison, Jr., Dayton, OH (US);

Inventors:

Shan Guan, Dublin, OH (US);

Michael F. Baumer, Dayton, OH (US);

Richard W. Sexton, Bainbridge, OH (US);

James E. Harrison, Jr., Dayton, OH (US);

Assignee:

Eastman Kodak Company, Rochester, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B21D 53/76 (2006.01); H01L 21/441 (2006.01);
U.S. Cl.
CPC ...
Abstract

An integrated orifice array plate and a charge plate is fabricated for a continuous ink jet print head by providing an electrically non-conductive orifice plate substrate having first and second opposed sides and an array of predetermined spaced-apart orifice positions. A plating seed layer is applied to the first of the opposed sides of the substrate, and an array of orifices is formed through the orifice plate substrate at the predetermined orifice positions. The orifices extend between the opposed sides. The plating seed layer is etched, leaving a portion of the plating seed layer adjacent to each of the predetermined orifice positions. A charge electrode is plated onto each of the portions of the plating seed layer.


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