The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2009
Filed:
May. 19, 2005
Shoriki Narita, Osaka, JP;
Shuichi Hirata, Osaka, JP;
Takafumi Tsujisawa, Osaka, JP;
Hirokuni Miyazaki, Osaka, JP;
Satoshi Shida, Osaka, JP;
Shoriki Narita, Osaka, JP;
Shuichi Hirata, Osaka, JP;
Takafumi Tsujisawa, Osaka, JP;
Hirokuni Miyazaki, Osaka, JP;
Satoshi Shida, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
In slack removal processing for removing slack generated on a wafer sheet by heating blow, a wafer feeding plate is positioned at a height position between a first height position and a second height position. This makes it possible to decrease a gap between an upper end portion of an expanding ring and a lower face of the wafer sheet and allows efficient and uniform processing. Moreover, setting the height position so as to avoid the contact between the wafer sheet and the upper end portion of the expanding ring at least when the slack removal processing is completed reliably prevents shrinking operation of the wafer sheet from being disturbed by the contact between the wafer sheet and the upper end portion.