The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2009
Filed:
Oct. 31, 2007
William James Anderl, Rochester, MN (US);
Vincenzo Valentino Di Luoffo, Sandy Hook, CT (US);
Eric Alan Eckberg, Rochester, MN (US);
David Roy Motschman, Rochester, MN (US);
Tamas Visegrady, Zurich, CH;
William James Anderl, Rochester, MN (US);
Vincenzo Valentino Di Luoffo, Sandy Hook, CT (US);
Eric Alan Eckberg, Rochester, MN (US);
David Roy Motschman, Rochester, MN (US);
Tamas Visegrady, Zurich, CH;
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method and computer processor system with anti-tamper capability and thermal packaging structure for implementing enhanced heat removal from processor circuitry, such as, a high-performance cell processor complex, and a design structure on which the subject circuit resides are provided. The computer system includes predefined processor circuits including anti-tamper logic. A volume container substantially contains the predefined processor circuits including the anti-tamper logic. A heat spreader is provided with the predefined processor circuits within the volume container. An external heatsink structure is attached to an outside cover above the volume container. The heatsink structure includes a heatsink base and a plurality of parallel fins extending outwardly from the heatsink base. A heat pipe extending through a folded mesh is attached to the heat spreader within the volume container and is attached to the external heatsink base providing an effective heat removal path for the processor circuits.