The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2009

Filed:

May. 05, 2006
Applicants:

Katsuya Hironaka, Fukuyama, JP;

Shinichi Sato, Fukuyama, JP;

Inventors:

Katsuya Hironaka, Fukuyama, JP;

Shinichi Sato, Fukuyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/94 (2006.01); H01L 21/336 (2006.01); H01L 31/062 (2006.01);
U.S. Cl.
CPC ...
Abstract

In the non-volatile semiconductor memory in which an N-type source diffusion layer and an N-type drain diffusion layer are formed on a P-type well formed on a substrate: the source diffusion layer has a protrusion portion and a depressed portion on a cross section taken along a plane that includes (a) a straight line extending along a direction of extension of the source diffusion layer and (b) a normal line of the semiconductor substrate, and the source diffusion layer is formed of a series of (a) an upper-wall layer constituting the protrusion portion, (b) a lower-wall layer constituting the depressed portion, and (c) a side-wall layer between the upper-wall layer and the lower-wall layer; a silicide is formed to cover the upper-wall layer, the lower-wall layer, and the side-wall layer, and an insulating layer is formed to cover the silicide; and a distance d between (a) an interface between the insulating layer and the silicide formed on the upper-wall layer and (b) an interface between the insulating layer and the silicide formed on the lower-wall layer is 1000 Å or shorter. This structure allows (i) miniaturization of the non-volatile semiconductor memory and (ii) reduction in a resistance of the source diffusion layer of the non-volatile semiconductor memory.


Find Patent Forward Citations

Loading…