The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2009
Filed:
Dec. 08, 2005
Hideyuki Hirakoso, Yokohama, JP;
Keisuke Abe, Yokohama, JP;
Yasuhiro Sanada, Yokohama, JP;
Kentarou Tsunozaki, Yokohama, JP;
Hideyuki Hirakoso, Yokohama, JP;
Keisuke Abe, Yokohama, JP;
Yasuhiro Sanada, Yokohama, JP;
Kentarou Tsunozaki, Yokohama, JP;
Asahi Glass Company, Limted, Tokyo, JP;
Abstract
It is to provide fine particles of copper, nickel or palladium hydride having an average particle diameter of at most 50 nm, which are hardly oxidized in the atmosphere and are excellent in storage stability and are thereby very suitable for formation of metallic materials, and their production process. Further, it is to provide a dispersion containing fine particles of copper, nickel or palladium hydride, which is excellent in storage stability, and a metallic material obtained by applying the dispersion, followed by baking. The fine particles of copper, nickel or palladium hydride and the dispersion thereof, to be obtained by the present invention, are applicable to various applications, and they can be used for e.g. formation and repair of printed wiring, etc. employing a dispersion, interlayer wiring in semiconductor packages, and joining of printed wiring boards and electronic components.