The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7550179 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 23, 2009

Filed:

Aug. 30, 2005
Applicants:

Jeffrey Scott Thompson, Wilmington, DE (US);

Alexander Zak Bradley, Drexel Hill, PA (US);

Kyung-ho Park, Wilmington, DE (US);

Inventors:

Jeffrey Scott Thompson, Wilmington, DE (US);

Alexander Zak Bradley, Drexel Hill, PA (US);

Kyung-Ho Park, Wilmington, DE (US);

Assignee:

E.I du Pont de Nemours and Company, Wilmington, DE (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 16/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Methods of depositing a copper film onto the surface of a substrate from a supercritical solution containing copper-containing precursors having monoanionic bidentate and neutral monodentate ligands, which comprise contacting the substrate with the solution; heating the substrate to a temperature between about 60° C. and less than 150° C.; and forming a copper-containing film on at least a portion of the substrate surface. Also provided are copper-containing precursor compositions used therein.


Find Patent Forward Citations

Thompson, Jeffrey. (2009). Method of copper deposition from a supercritical fluid solution containing copper (i) complexes with monoanionic bidentate and neutral monodentate ligands (U.S. Patent No. 7550179). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7550179

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