The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2009
Filed:
Apr. 25, 2005
Yuuji Umino, Fukushima, JP;
Hirofumi Tateyama, Fukushima, JP;
Yuuji Umino, Fukushima, JP;
Hirofumi Tateyama, Fukushima, JP;
Munekata Co., Ltd., Fukushima-Ken, JP;
Abstract
A molding method providing a homogeneous surface without any patch by dyeing or reforming a resin surface in a die concurrently to molding, in injection-, blow-, or compression molding, after thermoplastic resin is filled in a die cavity. After blow-molding, or after compression molding, mixture gas of carbon dioxide gas and a dye, or mixture gas of carbon dioxide gas and a reformer is injected between the resin and the die for forming a clearance, and pressure of the mixture gas is kept at a constant level. The mixture gas is dissolved in a molded surface, and a pressure is applied to contact the molded surface to the cavity face. The mixture gas in the clearance is exhausted and cooled, and the molded product is taken out. A dye-permeated layer or a reformer-permeated layer is formed on a surface of the molded product.