The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2009
Filed:
Jul. 17, 2008
Satoshi Yamamoto, Sakura, JP;
Mikio Hashimoto, Sakura, JP;
Takanao Suzuki, Sakura, JP;
Fujikura Ltd., Tokyo, JP;
Abstract
A pressure sensor package of the present invention includes a pressure sensor including a cavity disposed within a semiconductor substrate, wherein a region of the substrate above the cavity comprises a diaphragm section; a plurality of pressure-sensitive elements, wherein at least of portion of each pressure-sensitive element is disposed on the diaphragm section; and a plurality of conductive portions laterally spaced from the cavity and electrically connected to the pressure sensitive elements, a plurality of electrically conductive bumps arranged on the conductive portions and electrically connected to the conductive portions, wherein a total thickness Dof the semiconductor substrate, a thickness Dof the diaphragm section, a thickness Dof the cavity, and a thickness DD(DD) satisfy the relationships: (DD) in a range of approximately 5-20 μm, and Dnot less than about 100 μm.