The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2009
Filed:
May. 05, 2006
Timothy J. Dalton, Ridgefield, CT (US);
Anna Karecki, Legal Representative, Brooklyn, NY (US);
Samuel R. Mcknight, New Paltz, NY (US);
George F. Walker, New York, NY (US);
Timothy J. Dalton, Ridgefield, CT (US);
Anna Karecki, legal representative, Brooklyn, NY (US);
Samuel R. McKnight, New Paltz, NY (US);
George F. Walker, New York, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method to fabricate a high density, minimal pitch, thermally matched contactor assembly to maintain electrical contact with contact regions on fully processed semiconductors, preferably while still in wafer form, and throughout a range of temperatures. A guide plate and a contactor assembly for such use, comprising a substrate formed of a material having a coefficient of thermal expansion approximately equal to that of the device; and at least one hole in the guide plate for receiving an electrical contact (probe element) for contacting at least one respective region on said surface, said at least one hole being sized and shaped so as to accept said electrical contact, while allowing said electrical contact (probe element) to move with respect to said hole in said guide plate. The material can be one of silicon, borosilicate glass and cordierite.