The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2009
Filed:
Jun. 03, 2004
Isao Sato, Yokohama, JP;
Tomofumi Nishiura, Yokohama, JP;
Masato Nakajima, Yokohama, JP;
Kazuhiro Mimura, Tokyo, JP;
Yasuhiro Takemura, Tokyo, JP;
Kei Katou, Tokyo, JP;
Toshiharu Takesue, Tokyo, JP;
Isao Sato, Yokohama, JP;
Tomofumi Nishiura, Yokohama, JP;
Masato Nakajima, Yokohama, JP;
Kazuhiro Mimura, Tokyo, JP;
Yasuhiro Takemura, Tokyo, JP;
Kei Katou, Tokyo, JP;
Toshiharu Takesue, Tokyo, JP;
Sumitomo Osaka Cement Co., Ltd., Tokyo, JP;
Keio University, Tokyo, JP;
Abstract
A condition analysis apparatus capable of grasping the condition of an object easily and accurately is provided. The condition analysis apparatusincludes a three-dimensional sensorfor measuring sampling-point-moves in the height direction of an objectexisting in a target area at a plurality of sampling points, and area definition meansfor defining an area where a plurality of the sampling-point-moves are in the generally same phase. The thus constructed condition analysis apparatuscan grasp the condition of the objecteasily and accurately. Preferably, the condition analysis apparatusincludes information output meansfor outputting information of an area including the area defined by the area definition means