The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2009
Filed:
Dec. 19, 2006
Huang Detian, Hitachi, JP;
Hiromitsu Kuroda, Hitachi, JP;
Hakaru Matsui, Hitachi, JP;
Osamu Seya, Hitachi, JP;
Ryohei Okada, Hitachi, JP;
Shinichi Masui, Takahagi, JP;
Ryuji Nakagawa, Tokaimura, JP;
Hiroshi Okikawa, Hitachi, JP;
Huang Detian, Hitachi, JP;
Hiromitsu Kuroda, Hitachi, JP;
Hakaru Matsui, Hitachi, JP;
Osamu Seya, Hitachi, JP;
Ryohei Okada, Hitachi, JP;
Shinichi Masui, Takahagi, JP;
Ryuji Nakagawa, Tokaimura, JP;
Hiroshi Okikawa, Hitachi, JP;
Hitachi Cable, Ltd., Tokyo, JP;
Abstract
An extra-fine copper alloy wire has: a wire diameter of 0.010 to 0.025 mm; 1 to 3 weight % of silver (Ag), and a balance consisting copper (Co) and an inevitable impurity; a tensile strength of not less than 850 MPa; an electrical conductivity of not less than 85% IACS; an elongation of 0.5 to 3.0%; and a lowering rate in tensile strength of not more than 2%. The lowering rate is represented by [(1−σ/σ)×100%] where σis a tensile strength of the wire measured after a heat treatment under conditions of a heating temperature of not more than 350° C. and a heating time of not more than 5 seconds, and σis a tensile strength of the wire measured before the heat treatment.