The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2009
Filed:
Jul. 05, 2006
Applicant:
Hiroshi Ohara, Shiojiri, JP;
Inventor:
Hiroshi Ohara, Shiojiri, JP;
Assignee:
Seiko Epson Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/28 (2006.01); H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of manufacturing a semiconductor device, including: providing a semiconductor substrate which has a plurality of electrodes and in which a depression is formed on a side on which the electrodes are formed; forming a resin protrusion on the semiconductor substrate so that part of the resin protrusion is positioned in the depression; and forming an interconnect on the resin protrusion, the interconnect being electrically connected to at least one of the electrodes.