The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2009
Filed:
Apr. 11, 2006
Alan F. Benner, Poughkeepsie, NY (US);
How Tzu Lin, Vestal, NY (US);
Frank L. Pompeo, Redding, CT (US);
Subhash L. Shinde, Cortlandt Manor, NY (US);
Alan F. Benner, Poughkeepsie, NY (US);
How Tzu Lin, Vestal, NY (US);
Frank L. Pompeo, Redding, CT (US);
Subhash L. Shinde, Cortlandt Manor, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An optoelectronic assembly for an electronic system includes a thermally conductive, metallized transparent substrate having a first surface and an opposite second surface. A support chip set is bonded to the transparent substrate. A first substrate is in communication with the transparent substrate via the second surface and support chip set therebetween. A second substrate is in communication with the second surface of the first substrate and is configured for mounting at least one of data processing, data switching and data storage chips. An optoelectronic transducer is in signal communication with the support chip set, and an optical signaling medium having one end with an optical fiber array aligned with the transducer is substantially normal to the first surface of the transparent substrate. The support chip set and the transducer share a common thermal path for cooling.