The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2009
Filed:
Jan. 12, 2007
Toyokazu Yoshino, Fukuoka, JP;
Katsuya Okamoto, Fukuoka, JP;
Shigeki Ogata, Fukuoka, JP;
Shinji Morimoto, Fukuoka, JP;
Kouji Nakashima, Fukuoka, JP;
Toyokazu Yoshino, Fukuoka, JP;
Katsuya Okamoto, Fukuoka, JP;
Shigeki Ogata, Fukuoka, JP;
Shinji Morimoto, Fukuoka, JP;
Kouji Nakashima, Fukuoka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
Provided is an FPC, which comprises an insulating layer, wiring layersandlaminated above and under the insulating layer, and a layer connection for connecting the wiring layersandelectrically. The layer connection is constituted to comprise: a conductor press-fit holeof a cone shape extending through the insulating layerand the upper and lower wiring layersandand expanded to the side of one wiring layer; and a conductorfilled and press-fitted without any clearance in the conductor press-fit hole such that it is jointed to the wiring upper layerdeformed into the cone shape of the conductor press-fit hole, and is protruded from the other wiring lower layerto have its surface partially coated and jointed. As a result, the contact area between the wiring layersandand the conductorfilled in the conductor press-fit holecan be enlarged to retain the contact strength between the wiring layersandand the conductorsufficiently thereby to provide a high connection reliability for the layer connection.