The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2009
Filed:
Jun. 22, 2005
Lily Liong, San Jose, CA (US);
Kenneth D. Schatz, Los Altos, CA (US);
Gordon Craig, Palo Alto, CA (US);
Mark A. Hadley, Newark, CA (US);
Eric Kanemoto, San Jose, CA (US);
Lily Liong, San Jose, CA (US);
Kenneth D. Schatz, Los Altos, CA (US);
Gordon Craig, Palo Alto, CA (US);
Mark A. Hadley, Newark, CA (US);
Eric Kanemoto, San Jose, CA (US);
Alien Technology Corporation, Morgan Hill, CA (US);
Abstract
An embossing die, the die comprises one or more protruding features configured to create one or more corresponding recessed regions in a substrate; and a left side edge and a right side edge. Either the left side edge or the right side edge is a gradually sloping edge. The embossing die can be used to form an assembly. The assembly comprises a substrate including a more than one defined frames. Each of the defined frames comprises a plurality of recessed regions and a plurality of functional blocks, each functional block being deposited in one of the recessed regions. Each of the defined frames is separated from another frame by a region. The region can be a flattened region, a sloped region, or a plateau shaped region having a plateau top and two sloped sides, wherein each sloped side forms about 10-15 degree angle to a surface of the substrate.