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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7542125 B1

PDFFull Text
Expired
Date of Patent:
Jun. 02, 2009

Filed:

Nov. 16, 2005

Method for cutting an lcd substrate using coolant having low surface tension and low viscosity properties in which a partial cut, cooling with coolant and then a full cut takes place after coolant is removed

Applicants:

Gi-heon Kim, Daegugwangyeok-si, KR;

Dae-ho Choo, Suwon-si, KR;

Baek-kyun Jeon, Yongin-si, KR;

Hyung-woo Nam, Yongin-si, KR;

Inventors:

Gi-Heon Kim, Daegugwangyeok-si, KR;

Dae-Ho Choo, Suwon-si, KR;

Baek-Kyun Jeon, Yongin-si, KR;

Hyung-Woo Nam, Yongin-si, KR;

Assignee:

Samsung Electronics Co., Ltd., , KR;

Attorney:

Cantor Colburn LLP

Primary Examiner:

David Nelms

Assistant Examiner:

John Heyman

Int. Cl.
CPC ...
G02F 1/13 (2006.01); B23K 26/14 (2006.01);
U.S. Cl.
CPC ...
Abstract

Disclosed is a method of cutting a liquid crystal display (LCD) unit cell from an LCD assembly panel. The method includes applying a coolant onto heated cutting path formed on the LCD assembly panel. A rapidly heated portion of the substrate is rapidly cooled using water having a high specific heat or a mixed coolant in which a material for improving characteristics of surface tension, viscosity and thermal conductivity is dissolved in water. Therefore, the cutting quality of the substrate is improved, and a cutting speed is also enhanced.

Find Patent Forward Citations

Kim, Gi-Heon. (2009). Method for cutting an lcd substrate using coolant having low surface tension and low viscosity properties in which a partial cut, cooling with coolant and then a full cut takes place after coolant is removed (U.S. Patent No. 7542125). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7542125

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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